Force feedback electrodes in mems accelerometer

ABSTRACT

A microelectromechanical system (MEMS) accelerometer having separate sense and force-feedback electrodes is disclosed. The use of separate electrodes may in some embodiments increase the dynamic range of such devices. Other possible advantages include, for example, better sensitivity, better noise suppression, and better signal-to-noise ratio. In one embodiment, the accelerometer includes three silicon wafers, fabricated with sensing electrodes forming capacitors in a fully differential capacitive architecture, and with separate force feedback electrodes forming capacitors for force feedback. These electrodes may be isolated on a layer of silicon dioxide. In some embodiments, the accelerometer also includes silicon dioxide layers, piezoelectric structures, getter layers, bonding pads, bonding spacers, and force feedback electrodes, which may apply a restoring force to the proof mass region. MEMS accelerometers with force-feedback electrodes may be used in geophysical surveys, e.g., for seismic sensing or acoustic positioning.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No. 14/190,721, filed Feb. 26, 2014, which claims priority to U.S. Provisional Application Nos. 61/785,851, filed Mar. 14, 2013, and 61/786,259, filed Mar. 14, 2013. All of the above applications are incorporated by reference herein in their entireties.

BACKGROUND

Microelectromechanical system (MEMS) accelerometers are widely used in many different application areas such as geophysical surveying, underwater imaging, navigation, medical, automotive, aerospace, military, tremor sensing, consumer electronics, etc. These sensors typically detect acceleration by measuring the change in position of a proof mass, for example, by a change in the associated capacitance. Traditional capacitive MEMS accelerometers may have poor performance due to low noise suppression and sensitivity, however.

Measurement noise and range may vary for different applications of sensors. For example, for a navigation application, a measurement range of ±20 g may be desired and 1 μg/√Hz measurement noise for this range could be tolerated. As another example, a tremor sensing application may desire a ±1 g measurement range and a lower noise floor of ˜10-100 ng/√Hz. One type of noise affecting this noise floor is Brownian noise. Brownian noise refers to noise produced by Brownian motion. Brownian motion refers the random movement of particles suspended in a liquid or gas resulting from their bombardment by the fast-moving atoms or molecules in the liquid or gas.

Accelerometers may have many uses in the field of geophysical surveying, particularly marine seismic. For example, in some marine seismic embodiments, a survey vessel may tow one or more streamers in a body of water. Seismic sources may be actuated to cause seismic energy to travel through the water and into the seafloor. The seismic energy may reflect off of the various undersea strata and be detected via sensors on the streamers, and the locations of geophysical formations (e.g., hydrocarbons) may be inferred from these reflections.

These streamer sensors that are configured to receive the seismic energy may include accelerometers such as those described in this disclosure. (Various other sensors may also be included in some embodiments, such as pressure sensors, electromagnetic sensors, etc.)

Additionally, accelerometers may be used to detect the relative positions of the streamers (or portions thereof) via acoustic ranging. Acoustic ranging devices typically may include an ultrasonic transmitter and electronic circuitry configured to cause the transceiver to emit pulses of acoustic energy. The travel time of the acoustic energy between a transmitter and receivers (e.g., accelerometers) disposed at a selected positions on the streamers is related to the distance between the transmitter and the receivers (as well as the acoustic velocity of the water), and so the distances may be inferred.

In other marine seismic embodiments, accelerometers according to this disclosure may also be used in permanent reservoir monitoring (PRM) applications, for example at a seafloor. Generally, the term “geophysical survey apparatus” may refer to streamers, PRM equipment, and/or sensors that form portions of streamers or PRM equipment.

Accordingly, improvements in accelerometer technology (e.g., allowing better performance and/or lower cost) may provide substantial benefits in the geophysical surveying field, among other fields.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-C are block diagrams illustrating embodiments of a device;

FIG. 2 is a block diagram illustrating one embodiment of a MEMS accelerometer;

FIGS. 3A-C illustrate an exemplary process flow for the fabrication of a cap substrate;

FIGS. 4A-G illustrate an exemplary process flow for the fabrication of a fully differential MEMS accelerometer;

FIGS. 5A-E illustrate an exemplary process flow for the etching of cavities within a substrate; and

FIGS. 6-7 illustrate methods for the use of an accelerometer in a geophysical survey according to this disclosure.

DETAILED DESCRIPTION

This specification includes references to “one embodiment” or “an embodiment.” The appearances of the phrases “in one embodiment” or “in an embodiment” do not necessarily refer to the same embodiment. Particular features, structures, or characteristics may be combined in any suitable manner consistent with this disclosure.

The following paragraphs provide definitions and/or context for terms found in this disclosure (including the appended claims):

“Comprising.” This term is open-ended. As used herein, this term does not foreclose additional structure or steps. Consider a claim that recites: “a system comprising a processor and a memory . . . .” Such a claim does not foreclose the system from including additional components such as interface circuitry, a graphics processing unit (GPU), etc.

“Configured To” or “Operable To.” Various units, circuits, or other components may be described or claimed as “configured to” perform a task or tasks. In such contexts, “configured to” is used to connote structure by indicating that the units/circuits/components include structure (e.g., circuitry) that performs those task or tasks during operation. As such, the unit/circuit/component can be said to be configured to perform the task even when the specified unit/circuit/component is not currently operational (e.g., is not on). The units/circuits/components used with the “configured to” language include hardware—for example, circuits, memory storing program instructions executable to implement the operation(s), etc. Reciting that a unit/circuit/component is “configured to” perform one or more tasks is expressly intended not to invoke 35 U.S.C. §112, sixth paragraph, for that unit/circuit/component. Additionally, “configured to” can include generic structure (e.g., generic circuitry) that is manipulated by software and/or firmware (e.g., an FPGA or a general-purpose processor executing software) to operate in manner that is capable of performing the task(s) at issue.

“First,” “Second,” etc. As used herein, these terms are used as labels for nouns that they precede unless otherwise noted, and do not imply any type of ordering (e.g., spatial, temporal, logical, etc.). For example, a “first” computing system and a “second” computing system can be used to refer to any two computing systems. In other words, “first” and “second” are descriptors.

“Based On” or “Based Upon.” As used herein, these terms are used to describe one or more factors that affect a determination. These terms do not foreclose additional factors that may affect a determination. That is, a determination may be solely based on the factor(s) stated or may be based on one or more factors in addition to the factor(s) stated. Consider the phrase “determining A based on B.” While B may be a factor that affects the determination of A, such a phrase does not foreclose the determination of A from also being based on C. In other instances, however, A may be determined based solely on B.

FIGS. 1A-1C show block diagrams illustrating some exemplary embodiments of a device according to this disclosure (devices 100, 102, and 104, respectively), which differ in their capacitive architecture. These devices include upper substrate 110, interior substrate 130, and lower substrate 150. In various embodiments, substrates 110, 130, and 150 contain wafers 110 a, 130 a and 130 f (e.g., regions of the wafer on substrate 130), and 150 a respectively. In various embodiments, these wafers may be silicon wafers. As used herein, “wafer” is used broadly to refer to any substrate used for fabricating microelectromechanical system (MEMS) devices. As will be recognized by one skilled in the art with the benefit of this disclosure, “depositing” material on a substrate may occur according to various methods common in the MEMS device field. In some embodiments, this deposition method is performed as described below with reference to FIGS. 3 and 4. As depicted, interior substrate 130 is split into three portions, proof mass 130 a and anchor regions 130 f. In the illustrated embodiment, these portions are separated by cavities 130 g. Proof mass 130 a may also be referred to as a proof mass region. Cavities 130 g may be etched by various methods recognized by one skilled in the art with the benefit of this disclosure, including one embodiment described below with reference to FIG. 5. As is typically the case in accelerometer embodiments, proof mass 130 a undergoes a change in position when the device experiences an acceleration. By measuring the position of proof mass 130 a, the magnitude and direction of the acceleration may be determined.

In the embodiment shown in FIGS. 1A-C, upper substrate 110 is bonded to interior substrate 130, and lower substrate 150 is also bonded to interior substrate 130. Bonding may occur using any suitable method known in the art. In various embodiments, bonding between substrates 110 and 130 and between 150 and 130 occurs using any suitable bonding method. In one embodiment, cavity 120 between upper substrate 110 and interior substrate 130 and cavity 140 between lower substrate 150 and interior substrate 130 are vacuum-sealed. Cavities 130g may also be vacuum-sealed. In some embodiments, cavities 120 and 140 may be vacuum-sealed in part by bonding substrates 110, 130, and 150 together in a vacuum environment. Substrate 130 may have portions etched away such that vacuum-sealed cavities 130 g, cavity 120, and cavity 140 may be in fluid communication with each other (e.g., they may possess a common vacuum).

Turning now to FIG. 1A, a six-capacitor embodiment is shown as device 100. Substrates 110, 130, and 150 are divided into two parts: the wafers of each substrate (110 a; 130 a and 130 f together; and 150 a, respectively), and sets of electrodes (these are shown as elements 110 b, 110 p, and 110 c; 130 b, 130 p, and 130 c; 130 d, 130 q, and 130 e; 150 b, 150 q, and 150 c). These electrodes are typically deposited on an insulator layer (not shown) such as silicon dioxide, silicon nitride, etc. in order to electrically isolate them from one another, and they are configured to form the plates of respective capacitors. Two sets of electrodes are deposited/situated/disposed on interior substrate 130: the first set being on the upper surface, forming electrodes 130 b, 130 p, and 130 c; and the second set being on the lower surface, forming electrodes 130 d, 130 q, and 130 e. Said differently, the sets of electrodes on the interior substrate are deposited on the top and bottom of the interior substrate, or on opposite sides of the interior substrate. (Note that the phrase “opposite sides” of a structure such as a substrate is not limited to the top and bottom of a structure; instead, the phrase may be used to variously refer to the left and right sides of a structure, or the front and back sides of a structure. Of course, the characterization of different portions of a structure as top, bottom, left, right, front, and back depends on a particular vantage point.)

In one embodiment, a set of electrodes is deposited on the lower surface of upper substrate 110, forming electrodes 110 b, 110 p, and 110 c. A set of electrodes is also deposited on the upper surface of lower substrate 150, forming electrodes 150 b, 150 q, and 150 c. Both of these sets of electrodes on upper substrate 110 and lower substrate 150 may be referred to as a set of electrodes deposited, situated, or disposed on a surface opposing a surface of interior substrate 130 (i.e., the respective upper and lower surfaces of interior substrate 130). In some embodiments, the sets of electrodes may be deposited as metallic layers on each substrate.

In the embodiment shown in FIG. 1A, the set of electrodes on the upper substrate 110 and the opposing set of electrodes on the upper surface of interior substrate 130 are configured to form three capacitors. (E.g., electrodes 110 b and 130 b are configured to form one capacitor; electrodes 110 p and 130 p a second capacitor; and electrodes 110 c and 130 c, the third capacitor.) Similarly, the set of electrodes on lower substrate 150 and the opposing set of electrodes on the lower surface of interior substrate 130 are configured to form three capacitors.

As used herein, “opposing” surfaces are those that face each other. “Opposing” surfaces may be on the same substrate or on different substrates. For example, electrodes 130 b and 130 d are on opposing surfaces of substrate 130; electrodes 110 b and 130 b are on opposing surfaces of different substrates. As shown, in this embodiment the electrodes on opposing surfaces of different substrates may be formed such that they are in corresponding positions. This arrangement allows each pair of electrodes (e.g., 110 b and 130 b) to act as plates of a capacitor. As used herein, the term “deposited” refers to any fabrication technique in which a type of material is placed on at least a portion of an underlying material or layer.

The term “layer” is to be construed according to its ordinary usage in the art, and may refer to a material that covers an entire portion of one or more underlying materials, as well as discrete regions situated on top of the underlying material(s). Accordingly, a “layer” may be used to refer, for example, to the set of electrodes 130 b, 130 p, and 130 c depicted in FIG. 1A, which may result from a continuous deposition of material that is deposited and then partially etched away. In some embodiments—for example as described below with reference to FIG. 4—a certain layer may fall “below” another layer that was deposited first because the first deposited layer is not continuous. For example, a deposition of a piezoelectric material may be processed such that the layer contains discrete portions. Accordingly, when another spring layer is deposited, some portions of the spring layer may fall “below” the piezoelectric layer since it is not continuous. Thus, portions of the spring layer may appear to be at the same vertical level as the piezoelectric layer. Accordingly, in some instances, the term “layer” refers to the order of deposition, and not necessarily the vertical position (e.g., height) of materials in reference to one another.

Continuing with the discussion of FIG. 1A, the capacitors formed by electrodes 110 b and 130 b, 110 c and 130 c, 130 d and 150 b, and 130 e and 150 c may all be used as sense capacitors. What is meant by this is that they are operable to detect the movement of proof mass 130 a by using a system configured to detect changes in the capacitances. Because sets of electrodes deposited on the substrates are used for sensing the acceleration in device 100, these electrodes may be referred to as sensing electrodes or sense electrodes. The system detecting the changes in the capacitances may be any system that is configured to use the capacitances—for example, a closed-loop readout circuit. In other embodiments, along with vacuum packaging and piezoelectric damping, this capacitive architecture may be used in closed-loop accelerometer systems, as well as any other resonating MEMS structure. Together, the four capacitors may form a fully differential architecture. In one instance, as proof mass 130 a is displaced along the Z-axis 155 by an applied acceleration, two of the capacitors are increasing in capacitance, while the other two are decreasing equally. The differences in capacitances in each capacitor, as measured by any system configured to use capacitances, indicate the position of proof mass 130 a. In certain embodiments, with proper full bridge connection of these four capacitors, the architecture of device 100 may avoid some of the disadvantages in traditional capacitive sensing architectures—for example, less sensitivity, low noise suppression, and low SNR. These disadvantages may arise in part from Brownian noise.

In other embodiments, however, a simpler capacitive architecture may be used. For example, two sense capacitors may be used instead of four. In this embodiment, the capacitors may be arranged such as proof mass 130 a is displaced along the Z-axis by an applied acceleration, one capacitor is increasing in capacitance, while the other is decreasing. This is known as a “differential” architecture, in that the difference between capacitances is the figure of merit.

In yet other embodiments, a single sense capacitor may be used. In that embodiment, as proof mass 130 a is displaced along the Z-axis in one direction by an applied acceleration, the capacitance increases; as proof mass 130 a is displaced along the Z-axis in the other direction, the capacitance decreases. This embodiment may be referred to as a “single-ended” capacitive architecture.

A differential architecture typically provides a higher S/N ratio than a single-ended architecture, and a fully differential architecture typically provides even further S/N improvement. The differential and single-ended designs may be used in accordance with the present disclosure, however.

Continuing with the discussion of FIG. 1A, the capacitors formed by electrodes 110 p and 130 p, and 130 q and 150 q, respectively may be used as force feedback capacitors. In some embodiments of known devices, a capacitor may be used as both a sense capacitor and a force feedback capacitor, e.g. with the use of switching electronics. In such embodiments, only a portion (typically 50%) of the capacitor's duty cycle is allocated to each task, which may limit the maximum feedback force that can be applied.

According to the present disclosure, however, the use of separate force feedback electrodes may provide for continuous feedback, which may substantially increase the dynamic range compared to designs that switch the function of a capacitor according to a duty cycle. Further, the design of a device according to this disclosure may further be simplified through the omission of switching circuitry.

In the embodiment shown in FIG. 1A, device 100 is configured to perform in a fully differential capacitive architecture. As shown, the four outer capacitors (i.e., those formed by electrodes 110 b and 130 b, 110 c and 130 c, 130 d and 150 b, and 130 e and 150 c, respectively) act as sense capacitors, and the two inner capacitors (i.e., those formed by electrodes 110 p and 130 p, and 130 q and 150 q, respectively) act as force feedback capacitors. In other embodiments, the various capacitors may take on other roles. For example, the outer capacitors may form four force feedback capacitors, and the inner capacitors may form sense capacitors. It may be advantageous in some embodiments for the force feedback capacitor(s) to be symmetric with respect to the center of mass of proof mass 130 a. This feature may allow the force feedback capacitors to provide a linear restoring force without providing a torque.

The fully differential capacitive architecture embodiment depicted in FIG. 1A may allow the differences between capacitors (e.g., voltage, current, or capacitance) to be measured by another circuit (not shown). In some embodiments, a fully differential capacitive architecture may allow the capacitors to be connected using a full bridge connection or a Wheatstone bridge connection. In another embodiment, the fully differential capacitive architecture may be connected to differential readout circuitry, for example, using a differential operational amplifier. In some embodiments, these configurations may avoid the disadvantages of a low signal-to-noise ratio found in traditional MEMS accelerometers.

In addition, the architecture shown in FIG. 1A allows measurement of acceleration along an axis that perpendicularly intersects substrates 110, 130, and 150 (referred to as the “Z-axis” herein). Because proof mass 130 a is separated from anchor regions 130 f by cavities 130 g, anchor regions 130 f act as an anchor/stabilizer when proof mass 130 a moves upwards and downwards along Z-axis 155. This movement leads to slight variations in the position of proof mass 130 a, which leads to slight changes in the capacitance of the capacitors arranged in the fully differential architecture. This change in capacitance allows the capacitors to detect a change in the position of proof mass 130 a. The fully differential capacitive architecture shown in FIG. 1 thus allows a Z-axis acceleration to be measured. In another embodiment, device 100 may contain additional electrodes or capacitors situated surrounding interior substrate 130. With additional structural modifications, known to one skilled in the art, these additional electrodes or capacitors allow measurement of the acceleration of proof mass 130 a as it moves side-to-side (i.e., to the left or right of interior substrate 130) or front-to-back (i.e., into and out of sheet 1). In such an embodiment, device also includes lateral accelerometer capabilities. Accordingly, in one embodiment, device 100 may measure acceleration along Z-axis 155, as well as in an X-Y plane perpendicular to Z-axis 155 (i.e., a plane parallel to substrate 130). This allows an acceleration to be measured or detected in three dimensions.

Force feedback electrodes as shown in FIG. 1A may be used to maintain proof mass 130 a relatively close to its equilibrium, or rest, position. By design, proof mass 130 a tends to deviate from its equilibrium position as device 100 undergoes acceleration; however by maintaining proof mass 130 a relatively close to the equilibrium position, the system may be maintained in an approximately linear region of operation. Compared to an embodiment that does not use force feedback, this may allow for an increased range of accelerations measurable by device 100. In some embodiments, the output of device 100 may be based on the amount of force necessary to maintain proof mass 130 a at or near its equilibrium position, because this amount is directly related to the acceleration being experienced by device 100.

In other embodiments, electrodes may be formed such that only one sense capacitor and only one force feedback capacitor are used. In yet other embodiments, various numbers of sense capacitors and various numbers of force feedback capacitors may be used.

As noted above, Brownian noise is an important consideration in the design of devices such as device 100. The Brownian noise associated with a sensor such as a MEMS accelerometer may be represented by the following equation:

Noise_(MEMS)√{square root over (4k _(B) Tb)}/M

In this equation, k_(B) is Boltzmann's constant (1.381×10⁻²³ J/K), T represents the ambient temperature in K, b represents the damping coefficient in N s/m, and M represents the mass of the resonating structure. As can be seen by this equation, the Brownian noise of the system can be decreased by increasing the mass and decreasing the air damping of the system. By designing a huge mass for the accelerometer, thermal noise can be decreased down to on the order of hundreds of ng/√Hz levels, but practically, MEMS devices are not typically designed with such large sensor dimensions.

A high vacuum level may be used to decrease the Brownian noise by reducing the quantity of random interactions of air molecules with the sensor. Accordingly, the use of a vacuum may in some embodiments reduce the noise floor of the system to ng/√Hz levels. Thus in some embodiments, the use of a vacuum-sealed cavity, for example 120, 130 g, and 140, may reduce the Brownian noise inside device 100.

The use of a vacuum may, however, in some embodiments, increase the resonant quality factor of the system greatly. In some embodiments, the quality factor may increase to levels over 10,000. Such a high quality factor may contribute to undesirable instabilities in the operation of device 100. In some embodiments, piezoelectric damping may be used to at least partially counteract the effect of the high vacuum level. Piezoelectric damping transforms the kinetic oscillation energy of an accelerometer to electrical energy that may be dissipated outside the system, for example, by connecting the piezoelectric structures to a tunable external load (e.g., a tunable resistive load). Thus the quality factor may be decreased to manageable levels.

Besides the effects of Brownian noise on measurement noise and measurement range, non-linearities may affect the performance of MEMS devices. As one skilled in the art with the benefit of this disclosure will recognize, non-linearity of a MEMS device may be affected by frequency response, sensing architecture, springs, and/or the readout circuit. In particular, an accelerometer may have a region of approximate linearity while the proof mass is near its rest or equilibrium position. However, the farther the proof mass travels from its rest position, the readout may depart from the ideal linear response.

As noted above, the non-linearities in device 100 may in some embodiments be reduced by using a closed-loop readout circuit, which may be used to stabilize proof mass 130 a within a MEMS accelerometer to the region of its equilibrium position via the use of force feedback electrode(s). For example, a closed loop Σ-Δ circuit may be used.

In certain embodiments, a closed-loop readout circuit includes the sensing capacitors, as well as one or more force feedback electrodes. With these elements connected in a closed loop, the accelerometer may adjust the position of the proof mass to maintain linear operation, using the acceleration detected by the capacitors and a force applied by the force feedback electrodes. Thus, using a closed-loop circuit architecture with a MEMS accelerometer may avoid some of the disadvantages of such non-linearities.

Turning now to FIG. 1B, device 102 is shown. Device 102 is broadly similar to device 100, discussed above (and with corresponding reference numerals), but it has a different capacitive architecture. FIG. 1B depicts a “differential,” rather than a “fully differential” capacitive architecture. What is meant by this is that only two sense capacitors are used, instead of four.

In the embodiment depicted as device 102, for example, the capacitors formed by electrodes 110 c and 130 c, and 130 e and 150 c, respectively, may be used as sense capacitors. The capacitors formed by electrodes 110 p and 130 p, and 130 q and 150 q, respectively, may be used as force feedback capacitors. In other embodiments, these roles may be changed; however, it may in some embodiments be advantageous for the force feedback capacitors to be symmetric with respect to the center of mass of proof mass 130 a, as discussed above.

Turning now to FIG. 1C, another related device, device 104, is shown. Device 104 is broadly similar to device 102, discussed above (and with corresponding reference numerals), but the capacitors are arranged differently.

In this embodiment, four capacitors are disposed symmetrically on device 104. These may be used, in various embodiments, as either sense or force feedback capacitors. For example, the capacitors formed by electrodes 110 p and 130 p, and 130 e and 150 c, respectively, may be used as sense capacitors. The capacitors formed by electrodes 110 c and 130 c, and 130 q and 150 q, respectively, may be used as force feedback capacitors. In other embodiments, these roles may be changed; however, it may in some embodiments be advantageous for the force feedback capacitors to be symmetric with respect to the center of mass of proof mass 130 a, as discussed above.

Turning now to FIG. 2, a block diagram illustrating one embodiment of a MEMS accelerometer 200 is shown. As depicted, accelerometer 200 includes upper substrate 210, interior substrate 230, and lower substrate 250. In various embodiments, substrates 210, 230, and 250 contain wafers 210 a, 230 a and 230 f together, and 250 a respectively, all of which are similarly numbered to FIGS. 1A-1C, and may be configured as described above with reference to those figures. Additionally, in the embodiment shown, the wafer of interior substrate 230 is split into three portions, proof mass 230 a and anchor regions 230 f. In the illustrated embodiment, these portions are separated by cavities 230 g and bounded by protection structures 230 h. In one embodiment, protection structures 230 h may be silicon dioxide. In this embodiment, cavity 220 between upper substrate 210 and interior substrate 230, cavity 240 between lower substrate 250 and interior substrate 230, and cavities 230 g are vacuum-sealed. By vacuum-sealing, or vacuum-packaging, these cavities, certain embodiments of accelerometer 200 may avoid some of the disadvantages of Brownian noise discussed above.

Interior substrate 230 may include several parts: the silicon wafer, composed of proof mass 230 a and anchor regions 230 f; cavities 230 g (which may in some embodiments become vacuum-sealed cavities during processing), bounded by protection structures 230 h; sets of electrodes 230 b and 230 c; spring layers 230 d and 230 e; piezoelectric structures 230 j; and pairs of electrodes 230 k situated on piezoelectric structures 230 j. In one embodiment, substrates 210 and 250 are divided into four parts: the wafers of each substrate, 210 a and 250 a respectively; sets of electrodes 210 b and 250 b respectively; oxide layers, 210 c and 250 c respectively; and getter layers 210 d and 250 d. In this embodiment, the central ones of electrodes 210 b, 230 b, 230 c, and 250 b may be used as separate force feedback electrodes. The other ones of those electrodes may be used as sensing electrodes.

In the embodiment shown in FIG. 2, upper substrate 210 is bonded to interior substrate 230, and lower substrate 250 is bonded to interior substrate 230 as well. In various embodiments of FIG. 2, bonding between substrates 210 and 230 and between 250 and 230 occurs using any suitable bonding technique. As depicted, substrates 210, 230, and 250 are bonded to each other using bonding structures 260. Bonding structures 260 may be composed of any material known to one skilled in the art that may suitably vacuum seal cavities 220 and 240. In one embodiment, bonding structures 260 may be composed of silicon dioxide; in another, a metallic material or composition such as copper and tin. In other embodiments, bonding structures 260 may be composed of metallic compositions such as gold and tin, or aluminum and germanium. Alternately, bonding structures 260 may be composed of both silicon dioxide and metallic contacts. Cavities 220 and 240 may be vacuum-sealed in part by bonding structures 260. Substrates 210, 230, and 250 may also assist in vacuum-sealing cavities 220 and 240. In some embodiments, cavities 220 and 240 may be vacuum-sealed in part by bonding substrates 210, 230, and 250 together. Spring layers 230 d and 230 e may have portions etched away such that vacuum-sealed cavities 230 g, 220, and 240 may be in fluid communication with each other (e.g., they may possess a common vacuum). Thus, this vacuum-sealed cavity may be bounded in part by upper substrate 210, lower substrate 250, and protection structures 230 f. Bonding structures 260 and substrate 230 may also bound in part the common vacuum throughout cavities 220, 230 g, and 240.

In one embodiment, spring layers 230 d and 230 e are grown on opposing surfaces of interior substrate 230. In addition, as used herein, the term “grown” refers to any fabrication technique in which a type of material is formed on at least a portion of an underlying material or layer. This may be accomplished, for example, by heating that material or layer to high temperatures, by wet oxidation, etc. For example, heating a silicon substrate to high temperatures may create bonds with oxygen atoms in the air so that silicon dioxide is formed. Thus an insulating silicon dioxide layer may be formed using thermal oxidation of silicon. Spring layers 230 d and 230 e may be composed of an oxide such as silicon dioxide. Spring layers 230 d and 230 e allow proof mass 230 a to vary in position within interior substrate 230, with anchor regions 230 f assisting by adding stability to interior substrate 230. Vacuum-sealed cavities 230 g may assist in avoiding noise (e.g., Brownian noise) caused by the impingement of gas particles on proof mass 230 a. Oxide layers 210 c and 250 c are grown, or disposed, on the lower surface of upper substrate 210 and the upper surface of lower substrate 250, respectively. Oxide layers 210 c and 250 c may be composed of silicon dioxide. Getter layers 210 d and 250 d, which assist in maintaining the common vacuum of vacuum-sealed cavities 220, 240, and 230 g, are deposited on oxide layers 210 c and 250 c. In some embodiments, getter layers 210 d and 250 d may be deposited on any portion of substrates 210, 230, and 250 exposed to the vacuum-sealed cavity. In one embodiment, a single getter layer may exist within accelerometer 200, deposited on some portion of substrates 210, 230, and/or 250. Getter layers 210 d and 250 d may be composed of any suitable material known to those skilled in the art, and may assist, in some embodiments, in avoiding some of the disadvantages of Brownian noise within vacuum-sealed cavities 220, 230 g, and 240.

As shown, two sets of electrodes 230 b and 230 c may be deposited on spring layers 230 d and 230 e—the first on the upper surface of interior substrate 230; and the second, on the lower surface. Said differently, sets of electrodes 230 b and 230 c may be deposited on opposite sides of the interior substrate. A set of electrodes 210 b is deposited on the lower surface of upper substrate 210. A set of electrodes 250 b is also deposited on the upper surface of lower substrate 250. Both sets of electrodes 210 b and 250 b on upper substrate 210 and lower substrate 250 respectively may be referred to as a set of electrodes deposited on an opposing surface from the upper and lower surface respectively of interior substrate 230.

In the embodiment shown, sets of electrodes 210 b and 230 b are configured to form three capacitors. Similarly, sets of electrodes 230 c and 250 b are configured to form three capacitors. Overall, by forming these six capacitors, accelerometer 200 is configured to perform in a fully differential capacitive architecture with separate force feedback electrodes, for example, as described above with reference to FIG. 1A. Accordingly, in the embodiment depicted in FIG. 2, the fully differential capacitive architecture may allow the capacitors to operate together to detect changes in an acceleration of proof mass 230 a as it moves upwards and downwards along Z-axis 155. For example, the capacitors formed by sets of electrodes 210 b, 230 b, 230 c, and 250 c may detect an acceleration of accelerometer 200. Then, a closed-loop circuit or system may determine an acceleration of accelerometer using the measured electrical current, change in capacitance, or change in voltage of these capacitors. In some embodiments, this closed-loop circuit or system may be referred to as front-end readout circuitry, which may use a differential operational amplifier configuration. In some embodiments, accelerometer 200 may contain additional electrodes or capacitors situated surrounding interior substrate 230. With additional structural modifications known to one skilled in the art these additional electrodes or capacitors allow measurement of acceleration in an X-Y plane perpendicular to Z-axis 155. Such modifications would allow acceleration to be measured or detected in three dimensions.

In one embodiment, accelerometer 200 also includes piezoelectric structures 230 j disposed on spring layers 230 d and 230 e. Piezoelectric structures 230 j may be composed of any piezoelectric material. Piezoelectric structures 230 j translate mechanical energy from spring layers 230 d and 230 e into electrical energy, which may be dissipated externally via pairs of electrodes 230 k disposed on each piezoelectric structure 230 j. The piezoelectric material may bend due to the movement of proof mass 130 a, which is translated to mechanical energy by spring layers 230 d and 230 e. The addition of this piezoelectric damping may reduce the Q-factor of accelerometer 200. The Q-factor may be adjusted by tuning the load connected to electrodes 230 k.

FIGS. 3A-C illustrate an exemplary process flow for the fabrication of a cap substrate (e.g., a substrate similar substrate 110 or substrate 210). Turning now to FIG. 3A, substrate 310 may be a silicon wafer, etched for the later deposition of getter layers. Layer 320 is deposited or grown on substrate 310. Layer 320 may be further patterned. In one embodiment, layer 320 may be silicon dioxide.

Turning now to FIG. 3B, a set of electrodes 350 and metallic contacts 360 and 365 are deposited on layer 320. Notably, the set of electrodes 350 are isolated from one another on layer 320. Set of electrodes 350 may be any type of metallic contact. Metallic contacts 360 and 365 may in some embodiments be made of chromium, copper and tin, gold and tin, aluminum and germanium, etc., which may be patterned with any suitable method, such as lift-off or etching. In this embodiment, layer 320 is patterned further for the deposition of metallic contacts 365. In other embodiments, metallic contacts 360 and 365 may be deposited on another layer, which may be silicon dioxide, especially patterned for their deposition. This additional layer may be deposited partially on layer 320, for example, deposited only in the regions of metallic contacts 360 and 365.

Turning now to FIG. 3C, spacers 370 are deposited on layer 320. In some embodiments, spacers 370 may also be deposited on another layer, which may be silicon dioxide, especially patterned for their deposition. As depicted, spacers 370 may be silicon dioxide. In some embodiments, metallic contacts 360 and 365 and spacers 370 may operate as a bonding region to be bonded to another substrate as described below with reference to FIGS. 4A-G. In one embodiment, spacers 370 may be referred to as bonding spacers.

FIGS. 4A-G illustrate an exemplary process flow for the fabrication of a fully differential MEMS accelerometer with a separate force feedback electrode, according to one embodiment of this disclosure. Turning now to FIG. 4A, substrate 430 may be a silicon wafer. Trenches 415 may be filled with silicon dioxide. In one specific embodiment, trenches 415 may be 3 μm wide. To fill trenches 415, trenches 415 may be etched first by any method known to one skilled in the art. For example, in one embodiment, using deep reactive-ion etching (DRIE), 3 μm wide trenches are opened on the silicon wafer. Then, to fill trenches 415, oxide is grown on the surface of substrate 430. In another embodiment, this oxide may be used as a masking layer for etching in later fabrication stages, for example, XeF₂ (gaseous) etching to remove portions of substrate 430. The depth of trenches 415 may affect the thickness of the accelerometer proof mass because substrate 430 is part of the fully fabricated accelerometer. Referring briefly to FIG. 4D, because trenches 415 isolate proof mass 430 a from anchor regions 430 f, trenches 415 may be referred to as isolation trenches. Trenches 415 may also protect proof mass 410 a and anchor regions 410 f from possible later etching steps. Thus trenches 415 may also be referred to as protection trenches. Layer 420 is deposited/grown on substrate 430, also covering trenches 415. Layer 420 may be silicon dioxide. In one embodiment, layer 420 may also be patterned for deposition of subsequent layers or deposited portions. In this accelerometer embodiment, layer 420 may be referred to as a “spring layer.” One of ordinary skill in the art will understand that layer 420 may be of any suitable thickness according to design parameters. In one specific embodiment, the thickness of layer 420 may be 4 μm.

Turning now to FIG. 4B, metallic contacts 425 are deposited and patterned for deposition of piezoelectric structures 432. Metallic contacts 425 may be various metals, known to one skilled in the art. Piezoelectric structures 432 may be various piezoelectric materials, known to one skilled in the art. To form piezoelectric structures 432, piezoelectric material is deposited. In certain embodiments, both metallic contact 425 and piezoelectric structure 432 may be referred to as the piezoelectric structure.

Turning now to FIG. 4C, layer 440 is deposited/grown on layer 420 and patterned to protect the side walls of piezoelectric structures 432. Layer 440 may be silicon dioxide. Then top metallization is deposited on layer 440. This metallic deposition forms set of electrodes 450. Set of electrodes 450 are deposited so that the electrodes are isolated from each other on layer 440. In one embodiment with a further etching step, set of electrodes 450 may also be patterned. Layer 440 may also include another thin layer of silicon dioxide. That layer may be patterned so that the bonding regions, the regions extending laterally outwards from piezoelectric structures 432 (or the region surrounding and including bonding pads 427) are defined for the later bonding of spacers 460, which are depicted in FIG. 4D. These bonding regions may also be referred to as wafer bonding areas. Bonding pads 427 are deposited in the same metallic deposition as sets of electrodes 450. In one embodiment, bonding pads 427 may also be patterned, for example, especially for later bonding of a cap wafer. Finally, in the same metallic deposition, pairs of electrodes 455 are deposited on piezoelectric structures 432 and partially on layer 440. In the wafer bonding areas, set of electrodes 450, and pairs of electrodes 455, chromium may be patterned with lift off. In another embodiment, bonding pads 427, sets of electrodes 450, and pairs of electrodes 455 may be deposited and patterned in separate steps. For example, these elements may be deposited or electroplated. In some embodiments, the metals used for bonding pads 427, sets of electrodes 450, and pairs of electrodes 455 may be gold, aluminum, or chromium.

Turning now to FIG. 4D, cap wafer 475 is bonded to substrate 430 by any bonding process known to one skilled in the art. As part of substrate 430, proof mass 430 a is bounded in part by trenches 415, as well as spring layers 420 and 480. Spacers 460 may be aligned with the bonding region on substrate 430, and bonding pads 427 may be aligned with an opposing contact on cap wafer 475 between bonding spacers 460. In some embodiments, for example in accelerometer 200 as described above with reference to FIG. 2, the bonding process may establish the height of cavities 220 and 240 such that the capacitors formed by the electrodes have desired values. Because of this bonding process, in one embodiment, spacers 460 may be referred to as bonding spacers. In some embodiments, cap wafer 475 may be a cap wafer fabricated by the process illustrated in FIG. 3. Thus cap wafer 475 contains layer 470, which may be silicon dioxide, isolating the set of electrodes on cap wafer 475 opposing set of electrodes 450.

During this bonding process, set of electrodes 450 are aligned to oppose the set of electrodes on cap wafer 475 so that at least a portion of these sets of electrodes may form the capacitors to be used in a fully differential capacitive architecture. According to any suitable bonding process, the spacing of set of electrodes 450 from the set of electrodes on cap wafer 475 may be determined in order to give the capacitors formed thereby their desired values. In certain embodiments, the center electrode of set of electrodes 450 and the opposing electrode on cap wafer 475 may form electrode contacts to be used for force feedback. That is, these electrodes are operable to apply a feedback force to proof mass 430 a.

MEMS accelerometers, in order to operate in a regime of approximate linearity, may use electrodes to apply a force to the proof mass. In the embodiment depicted in FIG. 4D, the center electrode of set of electrodes 475 and the opposing electrode on cap wafer 475 may form electrode contacts to be used for force feedback. In some embodiments, this may avoid some of the disadvantages of MEMS accelerometers that use electrodes for sensing and force feedback at the same time. Certain MEMS accelerometers may switch between integration and feedback in a closed loop circuit, which may increase circuit complexity and may decrease the maximum feedback force applied. For example, because only a portion (typically 75-80%) of the duty cycle of such a switched-function electrode is available for force feedback, only a limited amount of feedback force may be applied.

But to operate in a closed loop circuit, accelerometers may need to apply force to the proof mass or structure. Thus in the embodiment shown, separate electrodes (in this embodiment, the center electrode of set of electrodes 450 and the opposing electrode on cap wafer 475) are used to apply force to the proof mass. Because these electrodes are used solely to apply force, these electrodes may be referred to as force feedback electrodes. These force feedback electrodes may receive feedback from an external circuit based on measurements taken at the sense electrodes to apply a force to the proof mass region, which may allow accelerometer 400 to avoid operating in a non-linear manner. Such force feedback electrodes may also allow accelerometer 400 to avoid switching complexity from an external circuit and may increase the measurement range of accelerometer 400.

The readout of such an accelerometer with separate force feedback electrodes may also be simplified. In one embodiment, the readout may simply be based on the force applied by the feedback electrodes. This is due to the fact that, in order to keep the proof mass near its equilibrium position, a force is required that is proportional to the overall acceleration being experienced by the accelerometer.

As shown in FIG. 4D, after cap wafer 475 is bonded to substrate 430, substrate 430 is ground from bottom up to the tip of trenches 415. (In some embodiments, substrate 410 may be ground somewhat beyond the tips of trenches 415.) Then layer 480 is grown/deposited on the bottom (or may be referred to as backside) of substrate 430. One of ordinary skill in the art will recognize that layer 480 may be of any suitable thickness according to design requirements. In one specific embodiment, the thickness of layer 480 may be 4 μm. In this accelerometer embodiment, layer 480 is referred to as a spring layer.

Turning now to FIG. 4E, layer 481, piezoelectric structures 486 (including metallic contacts), set of electrodes 490, pairs of electrodes 493, and bonding pads 494 are deposited onto layer 480 using the same or a similar process as outlined above with reference to FIGS. 4A-C, with similar corresponding elements.

Turning now to FIG. 4F, substrate 430 may be etched to form cavities between trenches 415 as described below with reference to FIG. 5. For example, XeF₂ gas may be used to etch the cavities. After etching, proof mass 430 a is separated from anchor regions 430 f by isolation trenches 415 and the cavities defined thereby, which may become vacuum-sealed in a later processing step.

Turning now to FIG. 4G, cap wafer 495 is bonded to substrate 430 using the same or similar process described above with reference to FIG. 4D. Spacers 460 may be aligned with the bonding region on substrate 430, and bonding pads may be aligned with an opposing contact on cap wafer 495 between bonding spacers 460 using known techniques. In some embodiments, cap wafer 495 may be a cap wafer fabricated by the same or similar process illustrated in FIG. 3. Thus cap wafer 495 contains layer 470, which may be silicon dioxide, isolating the set of electrodes on cap wafer 495 opposing the corresponding set of electrodes on substrate 430. At least a portion of these sets of electrodes may form the capacitors to be used in a fully differential capacitive architecture, and a separate portion may be used to form force feedback electrodes. Thus substrate 430 and cap wafers 475 and 495 are now fabricated to form, in this embodiment, a fully differential MEMS accelerometer. In certain embodiments, the bottom center electrode of substrate 430 and center electrode on cap wafer 495 may be selected to form electrode contacts to be used for force feedback. The use of electrodes at the center of proof mass 430 a for force feedback may have the advantageous effect of applying a linear force, but no torque, to proof mass 430 a. In some embodiments, for example in accelerometer 200, this last bonding step may form a common vacuum-sealed cavity throughout cavities 220, 230 g, and 240.

FIGS. 5A-E illustrate an exemplary process flow for the etching of cavities within a substrate. Turning now to FIG. 5A, substrate 530 may be a silicon wafer. Trenches 515 may be etched by any method known to one skilled in the art. For example, in one embodiment, using deep reactive-ion etching (DRIE), 3 μm wide trenches are opened on the silicon wafer. Trenches 515 may be used as protection layers, or protection structures, during the later isotropic release processes. The depth of trenches 515 may affect the thickness of the accelerometer proof mass. In an accelerometer implementation, for example in accelerometer 200, trenches 515 may be referred to as protection trenches.

Turning now to FIG. 5B, trenches 515 are grown/filled/deposited, with an oxide, for example silicon dioxide conformally. This filling process deposits a layer of oxide on the surface of substrate 530, which is removed with chemical mechanical polishing (CMP). Then layer 520 is grown/deposited on substrate 530. The thickness of layer 520, which may be silicon dioxide, may affect the thickness of the spring layers used in an accelerometer implementation. For example, layer 520 may correspond to spring layer 230 d on substrate 230 in accelerometer 200. Thus, in some embodiments, precise thickness control of layer 520 may be used during deposition.

Turning now to FIG. 5C, a bottom portion of substrate 530 is removed, for example through grinding and CMP. The removal may be up to the bottom of trenches 515. Then, turning now to FIG. 5D, layer 540 is grown/deposited on substrate 530. The thickness of layer 540, which may be silicon dioxide, may affect the thickness of a spring layer used in an accelerometer implementation. For example, layer 520 may correspond to spring layer 230 e on substrate 230 in accelerometer 200. Thus, in some embodiments, precise thickness control of layer 540 may be used during deposition. Layers 520 and 540 may be surface patterned for use as spring layers in an accelerometer embodiment.

Turning now to FIG. 5E, using either or both of photo resist and silicon dioxide as a mask layer, bulk silicon regions between trenches 515 are etched through substrate 530. In some embodiments, this etching process may be performed using dry vertical etching techniques, known to one skilled in the art. In some embodiments, the etching may be omitted; it may be advantageous to conduct the etching, however, in order to decrease the processing time of the subsequent processing step. After these trenches are etched, bonded wafers are placed into XeF₂ (gaseous) for isotropic release of substrate 530. Silicon dioxide covering all surfaces (i.e., through layers 520 and 540 and filled trenches 515) of substrate 530 act as a masking layer. Substrate 530 is etched as shown in FIG. 5E, leaving cavities 550. As discussed above, vacuum-sealing, or vacuum-packaging, cavities 550, implemented in an accelerometer, may avoid some of the disadvantages of Brownian noise.

Turning now to FIG. 6, a method in accordance with one embodiment of this disclosure is provided. Flow begins at step 600.

At step 600, a survey vessel tows a streamer including at least one accelerometer in accordance with this disclosure. In various embodiments, the streamer may include a plurality of accelerometers in accordance with this disclosure, and it may also include other sensors (e.g., pressure sensors and/or electromagnetic sensors). In some instances, the survey vessel may tow a plurality of such streamers. Flow proceeds to step 602.

At step 602, one or more seismic sources are actuated. These may be located on the survey vessel, towed by the survey vessel, towed by a different vessel, etc. Seismic energy from the seismic sources travels through the water and into the seafloor. The seismic energy then reflects off of the various geophysical formations. Various portions of the seismic energy may then be reflected upward toward the streamer, in some instances incorporating time delays and/or phase shifts that may be indicative of the geophysical formations. Flow proceeds to step 604.

At step 604, seismic energy is received at the accelerometers located on the streamers. Different portions of the seismic energy may reach the accelerometers either directly from the seismic sources, or after one or more reflections at the seafloor and/or water surface. Data based on the received seismic energy may then be used to infer information about geological structures that may exist under the seafloor. Flow ends at step 604.

Turning now to FIG. 7, an additional method in accordance with one embodiment of this disclosure is provided. Flow begins at step 700.

At step 700, a survey vessel tows streamers including acoustic transmitters, and also including accelerometers in accordance with this disclosure. In some instances, the acoustic transmitters and the accelerometers may be combined into an acoustic transceiver. Flow proceeds to step 702.

At step 702, one or more of the acoustic transmitters are actuated. The acoustic energy produced by the transmitters may travel through the water toward the other streamers. Flow proceeds to step 704.

At step 704, the acoustic energy is received by an accelerometer. The delay between the actuation of the acoustic transmitters and the reception at the accelerometer may be based in part on the distance between them. Flow proceeds to step 706.

At step 706, the positions of the streamers (or portions thereof) are determined. For example, such positions may be determined based on the distances between pairs of acoustic transmitters and accelerometers. Flow ends at step 706.

One of ordinary skill in the art with the benefit of this disclosure will understand that various aspects of this disclosure may in some embodiments be implemented via computer systems. Such computer systems may in some embodiments include various types of non-transitory computer-readable media, such as hard disks, CDs, DVDs, RAM, ROM, tape drives, floppy drives, etc.

Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the present disclosure, even where only a single embodiment is described with respect to a particular feature. Examples of features provided in the disclosure are intended to be illustrative rather than restrictive unless stated otherwise. The above description is intended to cover such alternatives, modifications, and equivalents as would be apparent to a person skilled in the art having the benefit of this disclosure.

The scope of the present disclosure includes any feature or combination of features disclosed herein (either explicitly or implicitly), or any generalization thereof, whether or not it mitigates any or all of the problems addressed herein. Accordingly, new claims may be formulated during prosecution of this application (or an application claiming priority thereto) to any such combination of features. In particular, with reference to the appended claims, features from dependent claims may be combined with those of the independent claims and features from respective independent claims may be combined in any appropriate manner and not merely in the specific combinations enumerated in the appended claims.

Numerous variations and modifications will become apparent to those skilled in the art once the above disclosure is fully appreciated. It is intended that the following claims be interpreted to embrace all such variations and modifications. 

What is claimed is:
 1. A method, comprising: towing a streamer behind a survey vessel in a body of water, wherein the streamer includes an accelerometer; detecting, by at least one sense capacitor within the accelerometer, an acceleration of a proof mass within the accelerometer; applying a feedback force to the proof mass via at least one feedback capacitor, wherein the feedback force is based on the acceleration of the proof mass; and determining an acceleration of the accelerometer based on the feedback force.
 2. The method of claim 1, wherein the detecting the acceleration includes detecting a change in capacitance of the at least one sense capacitor.
 3. The method of claim 2, wherein the detecting a change in the capacitance includes: detecting a change in the capacitance of a fully differential set of at least four sense capacitors.
 4. The method of claim 1, wherein determining the acceleration includes determining a Z-axis acceleration.
 5. The method of claim 1, wherein determining the acceleration includes using front-end readout circuitry connected to the at least one feedback capacitor.
 6. The method of claim 1, further comprising: actuating a seismic energy source to produce seismic energy, wherein the acceleration of the accelerometer is based at least in part on the seismic energy.
 7. The method of claim 1, further comprising: towing another streamer behind the survey vessel in the body of water; and actuating an acoustic transmitter on the another streamer to produce acoustic energy, wherein the acceleration of the accelerometer is based at least in part on the acoustic energy.
 8. A sensor configured to receive seismic energy, the sensor comprising: a MEMS accelerometer configured to measure Z-axis acceleration, wherein the MEMS accelerometer includes: a sense electrode configured to detect changes in position of a proof mass in the MEMS accelerometer; and a force feedback electrode configured to provide a restoring force to the proof mass, wherein the restoring force is based on the detected changes in the position of the proof mass.
 9. The sensor of claim 8, wherein the proof mass is adjacent to at least two vacuum-sealed cavities.
 10. The sensor of claim 8, further comprising a plurality of piezoelectric elements configured to dampen vibrations of the proof mass.
 11. The sensor of claim 8, wherein the MEMS accelerometer includes two sense electrodes arranged in a differential orientation.
 12. The sensor of claim 8, wherein the MEMS accelerometer includes four sense electrodes arranged in a fully differential orientation.
 13. The sensor of claim 8, further comprising closed-loop circuitry configured to measure the detected changes in the position of the proof mass and configured to apply a voltage to the force feedback electrode.
 14. The sensor of claim 13, wherein the accelerometer is further configured to output an acceleration value based on the voltage applied to the force feedback electrode.
 15. The sensor of claim 14, wherein the acceleration value output by the accelerometer is the voltage applied to the force feedback electrode.
 16. The sensor of claim 8, wherein the force feedback electrode forms a capacitor with an electrode on the proof mass.
 17. A sensor configured to receive seismic energy, the sensor comprising: an accelerometer that includes: a central substrate region; a first bonded substrate opposing a first surface of the central substrate region; a second bonded substrate opposing a second surface of the central substrate region; a first sense capacitor and a first force feedback capacitor formed between the first bonded substrate and the central substrate region; and a second sense capacitor and a second force feedback capacitor formed between the second bonded substrate and the central substrate region.
 18. The sensor of claim 17, wherein the central substrate region further includes: a proof mass region bounded by a first spring structure, a second spring structure, a first protection structure, and a second protection structure.
 19. The sensor of claim 18, further comprising: a vacuum-sealed cavity bounded in part by the first and second bonded substrates, the first and second protection structures, a third protection structure, and a fourth protection structure.
 20. The sensor of claim 19, wherein the first and second vacuum-sealed cavities are disposed laterally on either side of the proof mass region, and wherein the first and second bonded substrates are disposed vertically on either side of the central substrate region.
 21. The sensor of claim 19, wherein the first, second, third, and fourth protection structures include silicon dioxide.
 22. The sensor of claim 18, further comprising feedback circuitry configured to apply a continuous restoring force to the proof mass region based on measured values of the first and second sense capacitors. 